MediaTek, mobile phone chipmaker has launched the Helio P22, touted as the first budget SoC based on 12nm TSMC FinFET technology. The SoC is specifically designed for next-generation affordable smartphone and it will be available in smartphones by the end of Q2 2018. The new SoC has Octa-Core ARM Cortex A-53 processing units with MediaTek CorePilot, new IMG PowerVR GE8320 GPU, flexible LPDDR3/LPDDR4x memory controller, and supports dual-camera setup as well as artificial intelligence (AI) enhancements.
At present, a large number of the affordable smartphone in the market have an 18:9 aspect ratio, the Helio P22 SoC supports 20:9 HD+ screen with a resolution of 720 x 1600 pixels.
The Helio P22 chip also brings hardware-driven dual camera support for a combination of 13-megapixel and 8-megapixel sensors alongside 30 FPS frame rate or 21MP single camera setup, backed by a hardware depth engine for Depth of Field (Bokeh) effects, the chipset is equipped to minimize grain, noise, aliasing and chromatic aberration.
With P22, MediaTek offers the benefits of AI-accelerated experiences, brilliant photography and reliable, high-speed connectivity to even more affordably priced devices, expanding the “New Premium” market.
The Helio P22 also has AI-enhancements and it will support common AI frameworks like TensorFlow, Caffe, and Caffe2, and an auto-select function for the best available AI resource for developer efficiency, Helio P22 delivers the benefits of AI at a remarkably affordable price. It also supports advanced features such as Face Unlock, and smart photo album. The MediaTek NeuroPilot support allows developers & device makers to have the best possible AI-ecosystem with support for common AI frameworks and full compliance with Android Neural Networks API (Android NNAPI).
The chip also has 4G LTE WorldMode modem that integrates dual 4G SIM with VoLTE/ViLTE, 802.11ac for high-speed internet access. The MediaTek TAS 2.0 smart antenna technology and new standards like eMBMS, HUPE, Band 71 and advanced IMS. Connectivity upgrades include a new, dedicated sub-processor for 4-Satellite Global Navigation Satellite System (GNSS), and Bluetooth v5.0.
Commenting on the launch, TL Lee, General Manager of MediaTek’s Wireless Communication business unit, said:
“Our latest generation of Helio chips, such as the P60, have generated significant interest and exceeded our expectations. The continued customer demand we’re witnessing validates our focus on the growing mid-market segment and its clear consumers have an appetite for innovative devices that offer outstanding features at an affordable price point. With support for high-quality dual camera photography, AI enhancements, and incredible power efficiency, the Helio P22 sets a new bar for accessibility to premium features. We expect continued device maker wins and consumer growth in this segment with MediaTek’s new Helio P22 chipset.”
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